Tong Hsing Electronics Phils. Inc. stands as a prominent IC Hybrid assembly house with a specialization in Chip Scale Package (CSP) technologies, including Land Grid Array (LGA) and Ball Grid Array (BGA) packages. The company also excels in other areas such as PCB assembly using Surface Mount Technology (SMT) and Chip on Board (COB) processes. Additionally, Tong Hsing Electronics Phils. Inc. has expertise in Multi-Chip Modules, particularly in RF Modules, Image Products, and Ceramic Assembly manufacturing, employing Thick Film and DPC processes. The company operates within clean room environments that range from class 10 to 100K, ensuring the highest quality standards.
Driven by a commitment to continuous improvement and meeting customer expectations, Tong Hsing Electronics Phils. Inc. adheres to a comprehensive set of international quality assurance standards. These include ISO9001, IATF 16949, ISO14001, ISO45001, ISO17025, ISO13485, ESDS20.20, and MIL-PRF-19500. By adhering to these quality system requirements, the company maintains a rigorous quality management system and strives to consistently deliver exceptional products and services to its customers.
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